High Density 12L Anylayer HDI Printed Circuit Board Vr Mainboard with Laser Microvia

Product Description

High Density 12L Anylayer HDI Printed Circuit Board VR Mainboard With Laser Microvia

Product Description

The complete parameter record for this consumer-electronics VR headset PCB assembly case lists a 1.1 mm, 12-layer board with 7000+ pins, a 10 Gbps maximum rate, specified board material, a 12-layer arbitrary-order HDI design, 0.1 mm laser vias, 2.2 mil line width, 0.35 mm BGA pitch, and a laser FG, stepped, nano-sputtered coating steel stencil process. The current configuration is differentiated by its arbitrary-order HDI structure, 7000+ pin count, 10 Gbps maximum rate, fine interconnect parameters, and stepped steel stencil process

Product Parameters

 

Parameter	Value
Source Configuration	04:VR
Board type	VR (VR glasses)
Industry	(consumer electronics)
Board thickness	1.1 mm
Layer count	12 layers
Pin count	7000+
Maximum rate	10 Gbps
Board material	EM-526B
Design feature	12-layer arbitrary-order HDI design
Laser via	0.1 mm
Line width	2.2 mil
BGA pitch	0.35 mm
Stencil process	Laser FG + stepped + nano-sputtered coating steel stencil

 

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Frequently Asked Questions

Q1: What product scope does this listing describe?

A: This listing is a case-based record for a consumer-electronics VR headset printed circuit board assembly configuration. It documents a 12-layer arbitrary-order HDI board with a 1.1 mm thickness rather than presenting a separate product-model specification. The record also identifies 7000+ pins and a maximum rate of 10 Gbps for the documented configuration. No board dimensions are specified in the supplied case information

Q2: What configuration information and documentation are provided?

A: The supplied case documentation includes one layout visual and two photographs of assembled boards. It also lists a laser FG, stepped, nano-sputtered coating steel stencil process as part of the documented configuration. The information does not state a bill of materials, quantity, or shipment package, so those items cannot be treated as listed deliverables. The board is identified as a VR headset board for consumer electronics

Q3: What technical capability parameters are documented?

A: The documented maximum rate is 10 Gbps, and the configuration has 7000+ pins. Its 12-layer arbitrary-order HDI design is paired with a 0.1 mm laser via and 2.2 mil line width, describing the listed interconnect structure. These values are configuration parameters in a case record; no separate operating test conditions or measured results are specified in the supplied information for this board

Q4: What interface, structural, and compatibility details are available?

A: The board structure is specified as 12 layers with an arbitrary-order HDI design and a 1.1 mm overall board thickness. Listed connection-density details include 0.35 mm BGA pitch, 0.1 mm laser vias, and 2.2 mil line width. The supplied record identifies a VR headset board for consumer electronics, but it does not provide connector types, mating interfaces, environmental ratings, or system compatibility statements

Q5: What information should be referenced when evaluating this configuration?

A: To compare an inquiry with this documented configuration, reference the VR headset board type, consumer-electronics industry, and 12-layer arbitrary-order HDI structure. The available parameters also include 1.1 mm board thickness, 7000+ pins, 10 Gbps maximum rate, 0.1 mm laser vias, 2.2 mil line width, and 0.35 mm BGA pitch. A specified board material and laser FG, stepped, nano-sputtered coating steel stencil process are also recorded. The case record provides no board dimensions